Solder paste and flux are mixtures used in soldering in the electronics industry. Solder paste is a material used to bond different parts of a metal alloy together. Flux, on the other hand, is a cleaning material used to purify metal surfaces from the oxide layer.

Soldering is a term that describes the process of joining two separate metals together. Solder acts as a kind of adhesive to join metal surfaces after being heated and melted. This connection point where the solder paste holds the two surfaces together is called the solder joint.

Solder paste consists of powdered metal with a thick paste-like consistency. Solder paste has a sticky texture and works just like old glue. It is because the solder paste allows the transmission of different electrical energy and signals from the glue.

The solder paste temporarily holds the part on the circuit board. Controlled heating of the board is required for the metal parts to be permanently bonded together. The solder paste is melted using a soldering iron or similar heating device. When the solder paste melts, it provides the electrical and mechanical connection between the parts.

Flux is a cleaning agent that can be applied before or during the soldering process. The purpose of Flux is to prepare the metal surfaces to be bonded together for the soldering process. Flux is also used to add temporary tack properties to the solder paste mix.

Flux allows the oxide layer on metal surfaces to dissolve. It helps the solder to go into a liquid state and ensures a solid bond between the two objects. Flux is also essential for protecting metals from re-oxidation after brazing.